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ASRock

CPU

- Supports 13th Gen & 12th Gen and next gen Intel® Core™
Processors (LGA1700)

- Supports Intel® Hybrid Technology

- Supports Intel® Turbo Boost Max 3.0 Technology

- Supports Intel® Thermal Velocity Boost (TVB)

- Supports Intel® Adaptive Boost Technology (ABT)

 

Memory

- Dual Channel DDR5 Memory Technology

- 4 x DDR5 DIMM Slots

- Supports DDR5 non-ECC, un-buffered memory up to 7200+(OC)*

- Max. capacity of system memory: 192GB

- Supports Intel® Extreme Memory Profile (XMP) 3.0

 

*1DPC 1R Up to 7200+ MHz (OC), 4800 MHz Natively.

1DPC 2R Up to 6000+ MHz (OC), 4400 MHz Natively.

2DPC 1R Up to 5600+ MHz (OC), 4000 MHz Natively.

2DPC 2R Up to 4800+ MHz (OC), 3600 MHz Natively.

 

BIOS

- 128Mb AMI UEFI Legal BIOS with GUI support

 

Slots

CPU:

- 1 x PCIe 5.0 x16 Slot (PCIE1), supports x16 mode*

Chipset:

- 1 x PCIe 4.0 x1 Slot (PCIE2)*

- 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe WiFi module
and Intel® CNVio/CNVio2 (Integrated WiFi/BT)

- 15? Gold Contact in VGA PCIe Slot (PCIE1)

 

*Supports NVMe SSD as boot disks

 

Storage

CPU:

- 1 x Hyper M.2 Socket (M2_1, Key M), supports type 2260/2280 PCIe
Gen4x4 (64 Gb/s) mode*

Chipset:

- 1 x Hyper M.2 Socket (M2_2, Key M), supports type 2260/2280 PCIe
Gen4x4 (64 Gb/s) mode*

- 1 x Hyper M.2 Socket (M2_3, Key M), supports type 2260/2280 PCIe
Gen4x4 (64 Gb/s) mode*

- 4 x SATA3 6.0 Gb/s Connectors

 

*Supports Intel® Volume Management Device (VMD)

Supports NVMe SSD as boot disks

 

USB

- 2 x USB 3.2 Gen2 Type-C (1 Rear, 1 Front)

- 1 x USB 3.2 Gen2 Type-A (Rear)

- 6 x USB 3.2 Gen1 (4 Rear, 2 Front)

- 6 x USB 2.0 (2 Rear, 4 Front)

* All USB ports support ESD Protection

 

Form Factor

- Micro ATX Form Factor: 9.6-in x 9.6-in, 24.4 cm x 24.4 cm





- 2oz Copper PCB

Category : PC & LaptopPC ComponentsMotherboard
Brand : ASRock

Asrock B760M PG SONIC WIFI mATX Motherboard Intel LGA1700

MYR 1,035.00

MYR 0.00

Or MYR 345.00x 3 with
Gift Wrapping
GADGET PWP ONLY Microsoft Office APR24
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CPU

- Supports 13th Gen & 12th Gen and next gen Intel® Core™
Processors (LGA1700)

- Supports Intel® Hybrid Technology

- Supports Intel® Turbo Boost Max 3.0 Technology

- Supports Intel® Thermal Velocity Boost (TVB)

- Supports Intel® Adaptive Boost Technology (ABT)

 

Memory

- Dual Channel DDR5 Memory Technology

- 4 x DDR5 DIMM Slots

- Supports DDR5 non-ECC, un-buffered memory up to 7200+(OC)*

- Max. capacity of system memory: 192GB

- Supports Intel® Extreme Memory Profile (XMP) 3.0

 

*1DPC 1R Up to 7200+ MHz (OC), 4800 MHz Natively.

1DPC 2R Up to 6000+ MHz (OC), 4400 MHz Natively.

2DPC 1R Up to 5600+ MHz (OC), 4000 MHz Natively.

2DPC 2R Up to 4800+ MHz (OC), 3600 MHz Natively.

 

BIOS

- 128Mb AMI UEFI Legal BIOS with GUI support

 

Slots

CPU:

- 1 x PCIe 5.0 x16 Slot (PCIE1), supports x16 mode*

Chipset:

- 1 x PCIe 4.0 x1 Slot (PCIE2)*

- 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe WiFi module
and Intel® CNVio/CNVio2 (Integrated WiFi/BT)

- 15? Gold Contact in VGA PCIe Slot (PCIE1)

 

*Supports NVMe SSD as boot disks

 

Storage

CPU:

- 1 x Hyper M.2 Socket (M2_1, Key M), supports type 2260/2280 PCIe
Gen4x4 (64 Gb/s) mode*

Chipset:

- 1 x Hyper M.2 Socket (M2_2, Key M), supports type 2260/2280 PCIe
Gen4x4 (64 Gb/s) mode*

- 1 x Hyper M.2 Socket (M2_3, Key M), supports type 2260/2280 PCIe
Gen4x4 (64 Gb/s) mode*

- 4 x SATA3 6.0 Gb/s Connectors

 

*Supports Intel® Volume Management Device (VMD)

Supports NVMe SSD as boot disks

 

USB

- 2 x USB 3.2 Gen2 Type-C (1 Rear, 1 Front)

- 1 x USB 3.2 Gen2 Type-A (Rear)

- 6 x USB 3.2 Gen1 (4 Rear, 2 Front)

- 6 x USB 2.0 (2 Rear, 4 Front)

* All USB ports support ESD Protection

 

Form Factor

- Micro ATX Form Factor: 9.6-in x 9.6-in, 24.4 cm x 24.4 cm





- 2oz Copper PCB


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